Title:
SUBSTRATE PROCESSING APPARATUS, CONVEYANCE MECHANISM AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/070952
Kind Code:
A1
Abstract:
This substrate processing apparatus is for processing a substrate, and comprises: a chassis, the inside of which is under normal atmospheric pressure; a conveyance mechanism that is for conveying the substrate and that is provided inside the chassis; and a load lock module for passing the substrate to/from the conveyance mechanism. The conveyance mechanism includes: a holding arm for holding the substrate; a horizontal multiple-joint arm that is connected, at the leading end thereof, to the holding arm and that moves within a horizontal plane; and a vertical multiple-joint arm that is connected, at the leading end thereof, to the base end of the horizontal multiple-joint arm and that moves within a vertical plane that includes one horizontal direction and the vertical direction. At least a portion of the load lock module is disposed inside the chassis. Inside the chassis, an opening for substrate carrying-in/carrying-out is formed on a lateral surface, in the one horizontal direction, of the load lock module.
Inventors:
WAKABAYASHI SHINJI (JP)
Application Number:
PCT/JP2021/034114
Publication Date:
April 07, 2022
Filing Date:
September 16, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B25J19/00; H01L21/677
Foreign References:
| JPH0982780A | 1997-03-28 | |||
| JP2000277586A | 2000-10-06 | |||
| JP2018174186A | 2018-11-08 | |||
| JP2004265947A | 2004-09-24 | |||
| JP2000512082A | 2000-09-12 | |||
| JP2007283436A | 2007-11-01 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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