SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING THIN FILM

WIPO Patent Application WO/2011/135731

A1

Disclosed is a substrate processing apparatus wherein adhesion of dusts on a film applied on a substrate can be suppressed. The substrate processing apparatus is provided with: a spin-coating chamber (4a) wherein the film is applied on the substrate by spin-coating; a first air-conditioning mechanism, which adjusts the quantity of dusts in the air in the spin-coating chamber; an annealing chamber (7a) wherein the film applied on the substrate is lamp-annealed; a transfer chamber (2a), which is connected to the spin-coating chamber and the annealing chamber, and which transfers the substrate between the spin-coating chamber and the annealing chamber; and a second air-conditioning mechanism, which adjusts the quantity of dusts in the air in the transfer chamber.

SUZUKI, Mitsuhiro (956-1, Nishi-hirai, Nagareyama-sh, Chiba 56, 〒2700156, JP)
鈴木　光博 (〒56 千葉県流山市西平井９５６番地の１株式会社ユーテック内 Chiba, 〒2700156, JP)
KIJIMA, Takeshi (956-1, Nishi-hirai, Nagareyama-sh, Chiba 56, 〒2700156, JP)

JP2010/057919

November 03, 2011

April 28, 2010

Click for automatic bibliography generation  

YOUTEC CO., LTD. (956-1, Nishi-hirai Nagareyama-sh, Chiba 56, 〒2700156, JP)
株式会社ユーテック (〒56 千葉県流山市西平井９５６番地の１ Chiba, 〒2700156, JP)
SUZUKI, Mitsuhiro (956-1, Nishi-hirai, Nagareyama-sh, Chiba 56, 〒2700156, JP)
鈴木　光博 (〒56 千葉県流山市西平井９５６番地の１株式会社ユーテック内 Chiba, 〒2700156, JP)

H01L21/31; B05C11/08; B05C15/00; B05D1/40; B05D3/00; H01L21/677

YANASE, Mutsuyasu et al. (PATENT ATTORNEYS SHINPO, 8th Floor UK Building, 1-32-14, Takadanobaba, Shinjuku-k, Tokyo 75, 〒1690075, JP)

View/Download PDF      PDF Help

Previous Patent: INTERNAL COMBUSTION ENGINE SYSTEM CONTROL DEVICE

Next Patent: L-MODE GUIDED WAVE SENSOR