Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/057727
Kind Code:
A1
Abstract:
A substrate processing apparatus for processing a substrate that is provided with at least a nitride film and an oxide film. This substrate processing apparatus comprises: an aqueous phosphoric acid solution retainer part for retaining an aqueous phosphoric acid solution; an aqueous phosphoric acid solution supply part for supplying the aqueous phosphoric acid solution to the aqueous phosphoric acid solution retainer part through an aqueous phosphoric acid solution supply pipe; a silica additive supply part for supplying a silica additive to the aqueous phosphoric acid solution retainer part through a silica additive supply pipe; a water supply part for supplying water to the aqueous phosphoric acid solution retainer part through a water supply pipe; and a processing part in which the substrate is processed by means of the aqueous phosphoric acid solution retained in the aqueous phosphoric acid solution retainer part. In this connection, the silica additive supply pipe is connected to a midway of the water supply pipe, so that processing of a substrate is able to be carried out at an adequate silica concentration in cases where a silica additive is used for the processing.
Inventors:
MIYAZAKI KUNIHIRO (JP)
FURUYA MASAAKI (JP)
HAYASHI KONOSUKE (JP)
YAMAZAKI KATSUHIRO (JP)
SAITO YUKI (JP)
KOGAWA TAKEKI (JP)
FURUYA MASAAKI (JP)
HAYASHI KONOSUKE (JP)
YAMAZAKI KATSUHIRO (JP)
SAITO YUKI (JP)
KOGAWA TAKEKI (JP)
Application Number:
PCT/JP2016/079113
Publication Date:
April 06, 2017
Filing Date:
September 30, 2016
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP (JP)
International Classes:
H01L21/306
Foreign References:
| JP2010074060A | 2010-04-02 | |||
| JPH11186209A | 1999-07-09 | |||
| JPH11126764A | 1999-05-11 | |||
| JP2014209581A | 2014-11-06 | |||
| JP2013232593A | 2013-11-14 |
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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