SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

WIPO Patent Application WO/2018/146897

A1

The purpose of the present invention is to improve the thickness uniformity of a film of a chemical liquid supplied to a central region of a substrate while supplying the chemical liquid to the entire region of the top surface of the substrate. In order to achieve said purpose, the ejection direction when a first nozzle ejects a chemical liquid is set in a direction having: a component oriented upstream along a tangential direction at a first liquid-landing position; and a component oriented toward a rotation axis from the first liquid-landing position along a radial direction of the substrate, wherein the radial direction is perpendicular to the tangent. The tangential velocity component of the chemical liquid ejection velocity through the first nozzle has a magnitude that allows said chemical liquid to overcome the force oriented downstream and flow upstream, and the radial velocity component of the ejection velocity has a magnitude that allows said chemical liquid to overcome the centrifugal force and flow toward the rotation axis side. The ejection direction when a second nozzle ejects a chemical liquid is set in a direction having a component which is oriented downstream along a tangential direction at a second liquid-landing position when viewed from above the second nozzle.

OTA TAKASHI (JP)
YAMADA KUNIO (JP)
AIHARA TOMOAKI (JP)
OKUDA JIRO (JP)
HAYASHI MASAYUKI (JP)

PCT/JP2017/041506

August 16, 2018

November 17, 2017

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SCREEN HOLDINGS CO LTD (JP)

H01L21/304

JP2014132641A	2014-07-17
JP2015015284A	2015-01-22

YOSHITAKE Hidetoshi et al. (JP)

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