Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/235459
Kind Code:
A1
Abstract:
Provided are a substrate processing device and a substrate processing method that can form an applied film without loss of film thickness uniformity over both application processing and drying processing even when the substrate has warpage over the entire substrate. Specifically, the substrate processing device is configured to comprise a stage for mounting the substrate and holding the same by suction, an application processing unit for performing an application process to form the applied film on the substrate by discharging an application liquid onto the substrate mounted on the stage, and a drying processing unit for performing a drying process that dries the applied film formed on the substrate mounted on the stage, and is configured such that the stage is used for both the application processing unit and the drying processing unit, and the application process and the drying process are performed sequentially on the substrate without releasing the suction attachment state of the substrate mounted on the stage.
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Inventors:
OKAMOTO SHUNICHI (JP)
Application Number:
PCT/JP2018/018795
Publication Date:
December 27, 2018
Filing Date:
May 15, 2018
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
B05C13/02; B05C5/02; B05D1/26; B05D3/00; H01L21/027
Foreign References:
| JP2008018347A | 2008-01-31 | |||
| JP2010131488A | 2010-06-17 | |||
| JP2003262464A | 2003-09-19 | |||
| JP2003001182A | 2003-01-07 | |||
| JP2007048929A | 2007-02-22 | |||
| JP2015195276A | 2015-11-05 | |||
| JP2005223119A | 2005-08-18 | |||
| JP2003168643A | 2003-06-13 |
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