Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/054326
Kind Code:
A1
Abstract:
The present invention provides a substrate processing apparatus and a substrate processing method, which are capable of suppressing the occurrence of defective products by protecting a portion, which is exposed after etching, with an oxide film. A substrate processing apparatus 1 according to one embodiment of the present invention is provided with: a rotor 10 which holds and rotates a substrate W; a first processing liquid supply unit 40 which performs etching by supplying a first processing liquid for etching to a surface to be processed of the substrate W that is rotated by the rotor 10; and a second processing liquid supply unit 50 which performs, following the etching by means of the supply of the first processing liquid, an oxide film formation process by supplying a second processing liquid for oxidation to the surface to be processed of the substrate W that is rotated by the rotor 10.
Inventors:
KOYAMA HIROKI (JP)
Application Number:
PCT/JP2022/035858
Publication Date:
April 06, 2023
Filing Date:
September 27, 2022
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP (JP)
International Classes:
H01L21/306
Foreign References:
| JP2015041753A | 2015-03-02 | |||
| JP2019207923A | 2019-12-05 | |||
| JP2008078439A | 2008-04-03 | |||
| JP2014072389A | 2014-04-21 | |||
| JPH10116806A | 1998-05-06 | |||
| JPH1116866A | 1999-01-22 |
Attorney, Agent or Firm:
KIUCHI Mitsuharu et al. (JP)
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