Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/085598
Kind Code:
A1
Abstract:
The present invention relates to a substrate processing apparatus and a substrate processing method, which can accurately measure temperature in even a low-temperature region, thus making it possible to efficiently manage heat. The substrate processing apparatus comprises: a chamber for providing a processing space in which a substrate is processed; a substrate support provided in the processing space of the chamber in order to support the substrate; a heater provided with a plurality of semiconductor laser modules that emit light toward a first surface of the substrate; and a pyrometer which is provided on the side of a second surface of the substrate facing the first surface and detects light emitted from the substrate to measure the temperature of the substrate. The main light-emitting wavelength of the plurality of semiconductor laser modules may be shorter than the measurement wavelength of the pyrometer.
Inventors:
LEE DAE RYONG (KR)
JI SANG HYUN (KR)
KIM CHANG KYO (KR)
JI SANG HYUN (KR)
KIM CHANG KYO (KR)
Application Number:
PCT/KR2022/014545
Publication Date:
May 19, 2023
Filing Date:
September 28, 2022
Export Citation:
Assignee:
AP SYSTEMS INC (KR)
International Classes:
H01L21/67; G01J5/00; H01S5/183
Foreign References:
| KR20210034680A | 2021-03-30 | |||
| JP2003077857A | 2003-03-14 | |||
| KR20190118313A | 2019-10-18 | |||
| JP6461168B2 | 2019-01-30 | |||
| US20210285105A1 | 2021-09-16 |
Attorney, Agent or Firm:
AHN, Joon-Hyung et al. (KR)
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