Title:
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE TRANSFER APPARATUS, AND DENT DETECTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/155294
Kind Code:
A1
Abstract:
Disclosed is a substrate processing apparatus which can simply detect a dent formed on a substrate. The substrate processing apparatus (200) which processes the substrate (10) is provided with a load lock chamber (32), into which the substrate (10) is introduced from the outside, and a process chamber (35) connected to the load lock chamber (32). The load lock chamber (32) is provided with a laser light source (20), which outputs light (25a) that scans the whole surface of the rear surface (10b) of the substrate (10), and a light receiving element (22), which receives reflected light (25b) reflected by the rear surface (10b). The substrate processing apparatus (200) is provided with an analyzing apparatus (21), which detects presence/absence of the dent (90) by analyzing the reflected light (25b).
More Like This:
| JP2001264268 | SUBSTRATE INSPECTING DEVICE |
| JP63208746 | DEFECT INSPECTING DEVICE |
| JP08220022 | METHOD AND DEVICE FOR DETECTING DEFECT OF STRUCTURE AND/ OR PATTERN OF OBJECT |
Inventors:
SEKI, Masanori (())
Application Number:
JP2011/061419
Publication Date:
December 15, 2011
Filing Date:
May 18, 2011
Export Citation:
Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
International Classes:
G01N21/958; G01M11/00; G02F1/13
Attorney, Agent or Firm:
TESHIMA Masaru (Teshima Patent Law Firm, 5F MF MinamiMorimachi Bldg. 2-3-8, Tenjinbashi, Kita-ku, Osaka-sh, Osaka 41, 〒5300041, JP)
Download PDF:
Claims:
Previous Patent: WIRE CASSETTE AND SUBSTRATE TRANSFER APPARATUS USING SAME
Next Patent: DC/DC CONVERTER, POWER SUPPLY CIRCUIT, AND SEMICONDUCTOR DEVICE
Next Patent: DC/DC CONVERTER, POWER SUPPLY CIRCUIT, AND SEMICONDUCTOR DEVICE