Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/087435
Kind Code:
A1
Abstract:
Disclosed is a substrate processing apparatus provided with a cleaning chamber wherein a cleaning liquid, such as pure water, is supplied to a substrate which has been treated with a chemical solution. In the apparatus, concentrated drainage to be discharged from the cleaning chamber is reduced, and use efficiency of the diluted drainage recovered from the cleaning chamber is improved.
The substrate processing apparatus is provided with the cleaning chamber wherein the cleaning liquid is supplied by means of a cleaning liquid jetting means onto the surface of the substrate transferred by being tilted a predetermined angle to the rear surface side from the upright state. In the apparatus, the cleaning chamber is partitioned into a roughly cleaning chamber (103) in the upstream and a precisely cleaning chamber (104) in the downstream by means of a partitioning plate arranged upright on the bottom wall. Drainage ports are provided on the bottom walls of the roughly cleaning chamber and the precisely cleaning chamber, respectively, the roughly cleaning chamber is provided with a recovery launder (112), which receives the cleaning liquid that has been jetted from the cleaning liquid jetting means and has not run on the surface of the substrate, such that the launder is tilted downward toward the precisely cleaning chamber, and a recovery launder discharge port which discharges the cleaning liquid flowing in the recovery launder is provided to face the inside of the precisely cleaning chamber over the partitioning plate.
Inventors:
TANABE, Makoto (())
Application Number:
JP2010/051228
Publication Date:
August 05, 2010
Filing Date:
January 29, 2010
Export Citation:
Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町２２番２２号 Osaka, 〒5458522, JP)
International Classes:
H01L21/304; B08B3/02; G02F1/13; G02F1/1333
Attorney, Agent or Firm:
UENO, Noboru (KS Iseya Building 8th Floor, 21-23 Sakae 3-chome, Naka-ku, Nagoya-sh, Aichi 08, 〒4600008, JP)
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