Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2013/146793
Kind Code:
A1
Abstract:
This substrate processing apparatus includes: a substrate holding means, which horizontally holds a substrate; a substrate rotating means, which rotates the substrate about a perpendicular rotation axis line passing through the substrate, said substrate being held by means of the substrate holding means; a discharging member, which discharges a treatment liquid toward the substrate; and high temperature treatment liquid piping that supplies a flow channel with the treatment liquid at a temperature higher than that of the discharging member. The discharging member includes a plurality of discharge ports, which are respectively disposed at a plurality of positions at different distances from the rotation axis line, and the flow channel, which is sequentially connected to the discharge ports in the order from the outer side to the inner side. The discharge member discharges the treatment liquid toward the substrate from the discharge ports, said treatment liquid having been supplied to the discharge ports from the flow channel.
Inventors:
MIURA ATSUYASU (JP)
Application Number:
PCT/JP2013/058819
Publication Date:
October 03, 2013
Filing Date:
March 26, 2013
Export Citation:
Assignee:
DAINIPPON SCREEN MFG (JP)
International Classes:
H01L21/306; H01L21/304
Foreign References:
| JPH11165114A | 1999-06-22 | |||
| JP2010192875A | 2010-09-02 | |||
| JPH05185011A | 1993-07-27 |
Attorney, Agent or Firm:
INAOKA, Kosaku et al. (JP)
Kosaku Inaoka (JP)
Kosaku Inaoka (JP)
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