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Patent Searching and Data


Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/043976
Kind Code:
A1
Abstract:
A substrate processing apparatus may include a first disk provided in a chamber and configured to perform a turning motion and to include a plurality of seating holes periodically arranged within a specific radius from a center axis, a plurality of second disks provided in the seating holes, respectively, and configured to perform a revolving and rotating motion in accordance with the turning motion of the first disk, a first rotary connector structure provided between the second disk and the seating hole to allow for a rotating motion of and for an electric connection to the second disk, an electrostatic chuck provided on the second disk and configured to hold a substrate using an electric power supplied through the first rotary connector structure, and a first magnetic gear fixed to the second disk and configured to exert a torque on the second disk, and a second magnetic gear provided in the chamber to be interact with the first magnetic gear but prevented from turning.

Inventors:
SHIN SEUNG CHUL (KR)
YOO JIN HYUK (KR)
LEE MIN SU (KR)
CHOI DONG HWAN (KR)
Application Number:
PCT/KR2017/009107
Publication Date:
March 08, 2018
Filing Date:
August 22, 2017
Export Citation:
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Assignee:
JUSUNG ENG CO LTD (KR)
International Classes:
H01L21/027; H01L21/683; H01L21/687
Foreign References:
KR20160073281A2016-06-24
US20160230269A12016-08-11
JP5276388B22013-08-28
JP2011187566A2011-09-22
US20130134036A12013-05-30
Attorney, Agent or Firm:
NURY PATENT LAW FIRM (KR)
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