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Patent Searching and Data


Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/013524
Kind Code:
A1
Abstract:
The substrate processing method according to one embodiment of the present invention comprises: a step of arranging a substrate comprising silicon in a chamber; a reaction step of exposing the surface of the substrate to ammonium fluoride (NH4F) or ammonium bifluoride (NH4F(HF)); and an annealing step of annealing the substrate while exposing same to plasma.

Inventors:
YANG SEUNG KOOK (KR)
Application Number:
PCT/KR2018/007806
Publication Date:
January 17, 2019
Filing Date:
July 10, 2018
Export Citation:
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Assignee:
EUGENE TECHNOLOGY CO LTD (KR)
International Classes:
H01L21/324; H01J37/32; H01L21/02; H01L21/3065; H05H1/46
Foreign References:
KR101201964B12012-11-20
US20170084456A12017-03-23
KR20000034903A2000-06-26
KR101726804B12017-04-13
JP2012004274A2012-01-05
Attorney, Agent or Firm:
JEONG, Seong-Jin (KR)
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