Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/159468
Kind Code:
A1
Abstract:
Provided is a substrate processing apparatus for supplying a process fluid to a substrate, the apparatus comprising a nozzle tube (412) that discharges the process fluid onto the substrate, a fluid delivery tube (411) that is connected to the nozzle tube (412) and delivers process fluid to the nozzle tube (412), and a suction tube (413) that is connected to the nozzle tube (412) downstream of the fluid delivery tube (411) and suctions process fluid within the nozzle tube (412). The inner diameter of the nozzle tube (412) at least downstream of the position at which the suction tube (413) connects thereto is equal to or less than the inner diameter of the suction tube (413). As a result, the suction force for suctioning the process fluid reaches sufficiently into the nozzle tube. Accordingly, the process fluid is inhibited from remaining within the nozzle tube, making it possible to prevent dripping of the process fluid.
Inventors:
TANI TAKASHI (JP)
TANIZAWA SHIGEKI (JP)
AKIYAMA TAKASHI (JP)
TANIZAWA SHIGEKI (JP)
AKIYAMA TAKASHI (JP)
Application Number:
PCT/JP2018/042873
Publication Date:
August 22, 2019
Filing Date:
November 20, 2018
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/306
Foreign References:
| JP2017183568A | 2017-10-05 | |||
| JP2009099599A | 2009-05-07 | |||
| JP2013172079A | 2013-09-02 | |||
| JP2016063035A | 2016-04-25 |
Attorney, Agent or Firm:
NISHIDA Takami (JP)
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