Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/212270
Kind Code:
A1
Abstract:
A substrate processing apparatus, according to one embodiment of the present invention, comprises: a gas spraying part (101) comprising two gas distribution parts (140, 130) which are positioned at the upper part in a chamber (110) and are spatially separated, and two types of nozzles (133, 138) which are connected to the two gas distribution parts, respectively, and have mutually different lengths; a first electrode (120) connected to an RF power source and arranged at the lower part of the gas spraying part (101) so as to be perpendicularly spaced apart from the gas spraying part (101), and comprising a plurality of opening parts (122) into which, among the nozzles, one type of the nozzles are inserted, respectively; and a second electrode (152) for mounting a substrate and arranged so as to face the first electrode (120).
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Inventors:
KANG HO CHUL (KR)
Application Number:
PCT/KR2019/005296
Publication Date:
November 07, 2019
Filing Date:
May 03, 2019
Export Citation:
Assignee:
JUSUNG ENG CO LTD (KR)
International Classes:
C23C16/455; C23C16/505; C23C16/54; H01L21/02; H01L21/67
Foreign References:
| KR20140135202A | 2014-11-25 | |||
| KR20090092257A | 2009-08-31 | |||
| US20120045902A1 | 2012-02-23 | |||
| EP3136419A1 | 2017-03-01 | |||
| JP2012107329A | 2012-06-07 |
Attorney, Agent or Firm:
NURY PATENT LAW FIRM (KR)
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