Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/161636
Kind Code:
A1
Abstract:
Provided is a substrate processing apparatus capable of separating a component from the upper surface of a substrate without the use of heat treatment or chemical treatment. A substrate processing apparatus for separating an electronic component from a substrate having the electronic component attached to the upper surface thereof, the substrate processing apparatus comprising an upper surface processing unit that separates the electronic component from the upper surface of the substrate, wherein: the upper surface processing unit has an upper surface processing transport unit that transports the substrate from the upstream side to the downstream side and an upper surface rotary blade that separates the electronic component from the upper surface of the substrate; the upper surface processing transport unit has a sixth belt conveyor on the upstream side and a seventh belt conveyor on the downstream side, the conveyors being located below the upper surface rotary blade and arranged side by side in the transport direction; and the downstream portion of the upper surface rotary blade faces a gap situated between the sixth belt conveyor and the seventh belt conveyor.
Inventors:
MORI HIROYOSHI (JP)
Application Number:
PCT/JP2020/045691
Publication Date:
August 19, 2021
Filing Date:
December 08, 2020
Export Citation:
Assignee:
M DIA & CO LTD (JP)
International Classes:
B09B3/00; B02C18/16; B09B5/00
Foreign References:
| JP2018079423A | 2018-05-24 | |||
| JP2004202302A | 2004-07-22 | |||
| JPH1094781A | 1998-04-14 | |||
| JPH0254454B2 | 1990-11-21 |
Other References:
See also references of EP 4104941A4
Attorney, Agent or Firm:
MINAMI PATENT OFFICE (JP)
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