Title:
SUBSTRATE PROCESSING DEVICE CONTROL METHOD AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/005047
Kind Code:
A1
Abstract:
Provided are a substrate processing device control method and a substrate processing system. The present invention involves a) a step for partially etching a workpiece to form a recess in the workpiece, b) a step for forming a protective film on a side wall of the recess formed in the workpiece, c) a step for further etching the workpiece in which the recess and the protective film have been formed, d) a step for repeating b) and c), e) a step for monitoring the workpiece obtained at at least one of a) through d), f) a step for performing a virtual experiment that simulates a) through d), g) a step for deriving a parameter to be applied to at least one of a) through d) on the basis of the results of the monitoring of the workpiece and the results of the virtual experiment, and h) a step for performing at least one of a) through e) after application of the derived parameter.
Inventors:
KUMAKURA SHO (JP)
Application Number:
PCT/JP2023/023911
Publication Date:
January 04, 2024
Filing Date:
June 28, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065
Domestic Patent References:
| WO2020049974A1 | 2020-03-12 | |||
| WO2022132704A1 | 2022-06-23 |
Foreign References:
| JP2012186394A | 2012-09-27 | |||
| JP2005051210A | 2005-02-24 | |||
| JP2018152552A | 2018-09-27 | |||
| JP2008532324A | 2008-08-14 | |||
| JP2020053506A | 2020-04-02 | |||
| JP2022079865A | 2022-05-27 | |||
| JP2022526124A | 2022-05-23 |
Attorney, Agent or Firm:
KOHNO, Hideto et al. (JP)
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