Title:
SUBSTRATE PROCESSING DEVICE, COVER OPENING AND CLOSING MECHANISM, SHIELDING MECHANISM, AND METHOD FOR PURGING INSIDE OF CONTAINER
Document Type and Number:
WIPO Patent Application WO/2014/080851
Kind Code:
A1
Abstract:
Provided is a substrate processing device that can suppress the amount of inert gas and dry gas used and also can prevent reductions in throughput. A substrate processing device (10) is provided with: a loader module (13); an opener (42) that removes a cover (32) from a FOUP (30) having a main body (31), an opening part (33), and a cover (32) and forms a link between the inside of the FOUP (30) and the inside of the loader module (13) via the opening part (33); an N2 gas supply unit (47) that is attached to the loader module (13) and supplies N2 gas to the inside of the FOUP (30); and two plate-shaped slide covers (43, 44) that move freely of each other along an opening surface of the opening part (33). The slide covers (43, 44) shield the opening part (33) of the FOUP (30) that is attached to the loader module (13) from the inside of the loader module (13) by approaching each other until the gap therebetween is 1 - 3 mm.
Inventors:
WAKABAYASHI SHINJI (JP)
Application Number:
PCT/JP2013/080969
Publication Date:
May 30, 2014
Filing Date:
November 12, 2013
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/677
Domestic Patent References:
| WO2010007657A1 | 2010-01-21 |
Foreign References:
| JP2011159834A | 2011-08-18 | |||
| JP2008251627A | 2008-10-16 | |||
| JP2010232522A | 2010-10-14 | |||
| JP2003517724A | 2003-05-27 |
Attorney, Agent or Firm:
BECCHAKU, Shigehisa et al. (JP)
Role of another Shigehisa (JP)
Role of another Shigehisa (JP)
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