Title:
SUBSTRATE PROCESSING DEVICE, DISCHARGE METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2018/110086
Kind Code:
A1
Abstract:
A substrate processing device is provided with: a first valve that is provided between a gas supply source and an air-water separation tank and that opens and closes a flow path for a gas supplied from the gas supply source; a second valve that opens and closes a flow path for a liquid discharged from the discharge port of the air-water separation tank; and a control unit for controlling the first valve and the second valve. The discharge port of the air-water separation tank is connected with the discharge port of a cleaning chamber for cleaning a substrate. When the first valve is open and a state is reached in which gas from the air-water separation tank cannot be discharged therefrom, the control unit controls the valves so that the first valve is closed after a preset gas supply time elapses and the second valve is closed after the first valve is closed.
Inventors:
TOYOMURA NAOKI (JP)
IMAMURA AKIRA (JP)
IMAMURA AKIRA (JP)
Application Number:
PCT/JP2017/038126
Publication Date:
June 21, 2018
Filing Date:
October 23, 2017
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/683; H01L21/304
Foreign References:
| JP2015191897A | 2015-11-02 | |||
| JP2007201330A | 2007-08-09 |
Attorney, Agent or Firm:
OHNO Seiji et al. (JP)
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