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Patent Searching and Data


Title:
SUBSTRATE PROCESSING DEVICE, PROCESSING GAS CONCENTRATION DEVICE, AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/090723
Kind Code:
A1
Abstract:
In supplying a processing gas to perform substrate processing for manufacturing a semiconductor device, the present invention is provided with: a concentration tank that accommodates a porous member; and a separation mechanism configured to separate a processing gas adsorbed on the porous member. The porous member includes a metal organic structure configured to preferentially adsorb a processing gas mixed with a carrier gas. The processing gas is adsorbed to and stored in the porous member in the concentration tank and is separated by the separation mechanism when being used.

Inventors:
HARADA MUNEO (JP)
OKABE TSUNEYUKI (JP)
Application Number:
PCT/JP2020/040116
Publication Date:
May 14, 2021
Filing Date:
October 26, 2020
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C23C16/448; B01D53/04; B01J20/26; B01J20/34; C07C63/28; C07C63/307; C07C63/42; C07F1/08; C07F5/00; C07F11/00; C07F15/02; C23C16/455; H01L21/285
Foreign References:
JP2018500157A2018-01-11
JP2015165569A2015-09-17
JP2001220677A2001-08-14
JP2018021008A2018-02-08
JP2003342260A2003-12-03
JP2014083482A2014-05-12
JP2016533881A2016-11-04
JP2018513943A2018-05-31
JP2011231935A2011-11-17
JP2006237532A2006-09-07
JP2006046646A2006-02-16
Attorney, Agent or Firm:
YAYOY PATENT OFFICE (JP)
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