Title:
SUBSTRATE PROCESSING DEVICE AND METHOD FOR CLEANING SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/100829
Kind Code:
A1
Abstract:
This substrate processing device includes a control unit which causes the execution of: a cleaning step in which, in a state in which an upper-lower direction distance between an upper surface of a substrate (cleaning substrate) being held by a substrate holding unit and a lower surface of a cover member is a first distance, the upper surface of the substrate is supplied with a cleaning liquid from a cleaning liquid supply unit while the substrate is rotated by a rotational drive unit, thereby cleaning at least the lower surface of the cover member with the cleaning liquid filling a space between the upper surface of the substrate and the lower surface of the cover member; and a drying step in which, after the cleaning step, in a state in which the upper-lower direction distance is made a second distance greater than the first distance, the supply of the cleaning liquid from the cleaning liquid supply unit is stopped and the substrate is rotated by means of the rotational drive unit, thereby drying at least the lower surface of the cover member.
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Inventors:
TAKEBAYASHI SHUSEI (JP)
Application Number:
PCT/JP2019/044188
Publication Date:
May 22, 2020
Filing Date:
November 11, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; B08B3/02
Foreign References:
| JP2014036168A | 2014-02-24 | |||
| JP2014049565A | 2014-03-17 | |||
| JP2016072343A | 2016-05-09 |
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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