Title:
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND COMPUTER-READABLE RECORDING MEDIUM
Document Type and Number:
WIPO Patent Application WO/2017/158955
Kind Code:
A1
Abstract:
According to the present invention, whether wafer polishing is completed is determined with high accuracy for each wafer. A wafer processing method according to the present invention comprises: a first step for acquiring the initial state of a surface to be processed of a wafer; a second step for forming a coating film on the wafer after the first step; a third step for polishing the surface to be processed of the wafer by use of a polishing member on the basis of an initial polishing condition in a state where the polishing member is in contact with the surface to be processed of the wafer; a fourth step for acquiring the processing state of the processed surface of the wafer after the third step; and a fifth step for determining, on the basis of the initial state and the processing state, whether polishing has been completed, the degree of polishing is insufficient, or the degree of polishing is excessive.
Inventors:
KUBOTA MINORU (JP)
KYOUDA HIDEHARU (JP)
KYOUDA HIDEHARU (JP)
Application Number:
PCT/JP2016/086257
Publication Date:
September 21, 2017
Filing Date:
December 06, 2016
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B24B37/013; B24B49/12; H01L21/304
Foreign References:
| JPH10163139A | 1998-06-19 | |||
| JP2004022622A | 2004-01-22 | |||
| JP2003338493A | 2003-11-28 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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