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Title:
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE CONTROL METHOD
Document Type and Number:
WIPO Patent Application WO/2019/054083
Kind Code:
A1
Abstract:
This substrate processing device 1 performs substrate processing with a processing solution. The substrate processing device comprises: a chamber 10 capable of forming a sealed space wherein the substrate W is accommodated; a processing tank 11 disposed in the interior of the chamber, for storing the processing solution; a liquid elimination mechanism 17 for draining the processing solution from the interior of the chamber; a pressure-reducing mechanism 16 equipped with a vacuum pump 161, for reducing the pressure inside the chamber; and control means 19 controlling the pressure-reducing mechanism and the liquid elimination mechanism in such a manner that the pressure inside the chamber is reduced and the processing solution is drained under reduced pressure from the interior of the chamber.

Inventors:
KIMURA, Masahiro (Tenjinkita-machi 1-1, Teranouchi-agaru 4-chome, Horikawa-dori, Kamigyo-ku, Kyoto-sh, Kyoto 85, 〒6028585, JP)
YAMAGUCHI, Yuji (Tenjinkita-machi 1-1, Teranouchi-agaru 4-chome, Horikawa-dori, Kamigyo-ku, Kyoto-sh, Kyoto 85, 〒6028585, JP)
KAMIHIRO, Yasukatsu (Tenjinkita-machi 1-1, Teranouchi-agaru 4-chome, Horikawa-dori, Kamigyo-ku, Kyoto-sh, Kyoto 85, 〒6028585, JP)
Application Number:
JP2018/029283
Publication Date:
March 21, 2019
Filing Date:
August 03, 2018
Export Citation:
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Assignee:
SCREEN HOLDINGS CO., LTD. (Tenjinkita-machi 1-1, Teranouchi-agaru 4-chome Horikawa-dori, Kamigyo-ku, Kyoto-sh, Kyoto 85, 〒6028585, JP)
International Classes:
H01L21/304; F26B5/04; F26B25/00
Foreign References:
JPH06163508A1994-06-10
JPH1126423A1999-01-29
JP2008004874A2008-01-10
JP2013149666A2013-08-01
JP2012222306A2012-11-12
JP2013111546A2013-06-10
JPH11145100A1999-05-28
Attorney, Agent or Firm:
HIRAKAWA, Akira et al. (Acropolis 21 Building 8th floor, 4-10 Higashi Nihonbashi 3-chome, Chuo-k, Tokyo 04, 〒1030004, JP)
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