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Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD, FAST ROTARY VALVES, CLEANING METHOD
Document Type and Number:
WIPO Patent Application WO/2003/081659
Kind Code:
A1
Abstract:
A substrate processing device capable of setting the conductance of an exhaust port when a reaction container is evacuated to a small value so as to form laminar flow in the reaction container during an ALD process, and to a large value so as to purge the inside of the reaction container in a short time during a purge process. Exhaust ports (201a, 201b) in a substrate processing device (40) each have a slit shape extending in a direction almost orthogonal to a laminar flow direction. Rotary valves (25A, 25B) provided with valve discs having respectively slit-like openings corresponding to the above slit shapes engage the above exhaust ports. A conductance changes with the rotation of a valve disc in a rotary valve.

Inventors:
SHINRIKI HIROSHI (JP)
ARAMI JUNICHI (JP)
Application Number:
PCT/JP2003/003655
Publication Date:
October 02, 2003
Filing Date:
March 25, 2003
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
SHINRIKI HIROSHI (JP)
ARAMI JUNICHI (JP)
International Classes:
B08B7/00; C23C16/44; C23C16/455; F16K5/04; F16K51/02; (IPC1-7): H01L21/31; F16K5/04; F16K51/02
Domestic Patent References:
WO2002015243A12002-02-21
WO2002009166A12002-01-31
WO1999020925A11999-04-29
Foreign References:
JP2000068209A2000-03-03
JPH048872U1992-01-27
US6206029B12001-03-27
Other References:
See also references of EP 1489651A4
Attorney, Agent or Firm:
Itoh, Tadahiko (Yebisu Garden Place Tower 20-3, Ebisu 4-chom, Shibuya-ku Tokyo, JP)
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