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Patent Searching and Data


Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR IMPROVING SUBSTRATE STICKINESS
Document Type and Number:
WIPO Patent Application WO/2023/219205
Kind Code:
A1
Abstract:
Disclosed are a substrate processing device and a substrate processing method, which control, for each lifting section, the lifting speed of a lift pin for lifting a substrate, and thus improve substrate stickiness. The substrate processing device according to an embodiment of the present invention comprises: a control unit for variably controlling the lifting speed of a plurality of lift pins for each of a plurality of lifting sections set on the basis of the lifting heights of the plurality of lift pins that lift a substrate with respect to a support chuck; and a driving unit for driving the plurality of lift pins at a first lifting speed in a first lifting section in which the substrate is lifted, to a set second height, from a first height at which the substrate is placed on the support chuck, and driving the plurality of lift pins at a second lifting speed in at least a part of a second lifting section between the second height and a set third height. The first lifting speed is set to a speed less than or equal to the half of the second lifting speed so as to prevent the substrate from being shaken or displaced and eliminate the stickiness by which the substrate adheres to the upper surface of the support chuck.

Inventors:
LEE GUNWOO (KR)
Application Number:
PCT/KR2022/009901
Publication Date:
November 16, 2023
Filing Date:
July 08, 2022
Export Citation:
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Assignee:
PSK HOLDINGS INC (KR)
International Classes:
H01L21/687; H01J37/32; H01L21/683
Foreign References:
KR20210086748A2021-07-09
KR20190136717A2019-12-10
KR20200005448A2020-01-15
KR20120048879A2012-05-16
KR20210039526A2021-04-12
Attorney, Agent or Firm:
KANG, Il Shin et al. (KR)
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