Title:
SUBSTRATE PROCESSING DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICES, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2017/175408
Kind Code:
A1
Abstract:
Provided is a configuration for maintaining productivity and automatically controlling the execution of recipes. A configuration provided with a processing chamber in which a substrate is processed, a first transfer chamber in which the substrate is transferred in a vacuum, a second transfer chamber in which the substrate is transferred at atmospheric pressure, a preparatory chamber that links the first transfer chamber and the second transfer chamber, and enables pressure to be reduced, and a control unit that respectively executes a maintenance recipe in the preparatory chamber and a production recipe in the processing chamber, wherein when the control unit receives an instruction for executing the production recipe while the maintenance recipe is being executed, the control unit temporarily stops the maintenance recipe and executes the production recipe as a priority, and after the production recipe has finished, continues to execute the temporarily-stopped maintenance recipe.
Inventors:
SAITO KAZUHITO (JP)
YASHIMA TSUKASA (JP)
YASHIMA TSUKASA (JP)
Application Number:
PCT/JP2016/078436
Publication Date:
October 12, 2017
Filing Date:
September 27, 2016
Export Citation:
Assignee:
HITACHI INT ELECTRIC INC (JP)
International Classes:
H01L21/02; H01L21/677; H01L21/205; H01L21/31
Foreign References:
| JP2011181771A | 2011-09-15 | |||
| JP2004281832A | 2004-10-07 | |||
| JP2000195805A | 2000-07-14 | |||
| JP2014232816A | 2014-12-11 | |||
| JP2009267218A | 2009-11-12 |
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