Title:
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2017/047355
Kind Code:
A1
Abstract:
[Problem] To prevent an abnormal resist pattern from forming on a peripheral edge part of a substrate.
[Solution] This substrate processing method is provided with: a step for acquiring a height distribution for peripheral edge parts of the surface of a substrate along the radial direction of the substrate; next, a step for forming an underlayer film on the entire surface of the substrate such that height declines at the peripheral edge part are corrected on the basis of the height distribution; and a step for forming a resist film on the entire surface of the underlayer film thereafter. Therefore, offsetting of focus on the resist film surface at the peripheral part of the substrate during exposure can be suppressed. As a result, formation of abnormal resist patterns at the peripheral edge parts can be suppressed.
Inventors:
KODAMA TERUHIKO (JP)
ENOMOTO MASASHI (JP)
TADOKORO MASAHIDE (JP)
HASHIMOTO TAKAFUMI (JP)
ENOMOTO MASASHI (JP)
TADOKORO MASAHIDE (JP)
HASHIMOTO TAKAFUMI (JP)
Application Number:
PCT/JP2016/075001
Publication Date:
March 23, 2017
Filing Date:
August 26, 2016
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/027; B05C9/14; B05C11/08; B05D1/36; B05D3/00; G01B11/02; G03F7/26
Foreign References:
| JP2010165959A | 2010-07-29 | |||
| JP2004186419A | 2004-07-02 | |||
| JP2003234278A | 2003-08-22 | |||
| JPH08222550A | 1996-08-30 | |||
| JPH08107056A | 1996-04-23 |
Attorney, Agent or Firm:
INOUE, Toshio et al. (JP)
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