SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM HAVING PROGRAM FOR PERFORMING SUBSTRATE PROCESSING METHOD RECORDED THEREIN

WIPO Patent Application WO/2019/112042

A1

[Problem] To remove an attached material (such as a hard mask) on a substrate from the substrate effectively. [Solution] This substrate processing method comprises: (A) a step of supplying a substrate with a first processing solution containing an attached material removing agent, a solvent having a boiling point lower than a boiling point of the removing agent, and a thickening agent; (B) a step, after step (A), of supplying the substrate with a second processing solution containing an organic polymer for forming a gas diffusion prevention film; (C) a step, after step (B), of heating the substrate at a predetermined temperature not lower than the boiling point of the solvent and lower than the boiling point of the removing agent, to promote evaporation of the solvent and a reaction between the attached material and the removing agent; and (D) a step, after step (C), of supplying the substrate with a rinsing solution to remove the attached material from the substrate. The gas diffusion prevention film prevents a gaseous reactive product, produced by the reaction of the attached material and the removing agent in step (C), from passing through the gas diffusion prevention film and diffusing around the substrate.

KAGAWA KOJI (JP)
TOSHIMA TAKAYUKI (JP)

PCT/JP2018/045099

June 13, 2019

December 07, 2018

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TOKYO ELECTRON LTD (JP)

H01L21/304; H01L21/306

WO2009096480A1

2009-08-06

JP2016186971A	2016-10-27
JP2006100482A	2006-04-13

NAGAI Hiroshi et al. (JP)

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