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Patent Searching and Data


Title:
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2019/159704
Kind Code:
A1
Abstract:
According to the present invention, a heat treatment unit is provided with: a hot plate on which a wafer is placed and which applies heat to the wafer; a heater that heats the hot plate; a plurality of temperature sensors that are provided corresponding to a plurality of channels of the hot plate and that measure the temperature of the hot plate; and a controller. The controller is configured to: calculate, for each of the plurality of channels, a temperature shift amount which is the differences between a display temperature of the temperature sensor and the ideal temperature according to the settings of the heater, and determine whether the temperature shift amount is within a predetermined band width; and specify, as abnormal regions, the channels in which the temperature shift amount is not within the band width.

Inventors:
MISAKA Shinichiro (1-1 Fukuhara Koshi Cit, Kumamoto 16, 〒8611116, JP)
Application Number:
JP2019/003476
Publication Date:
August 22, 2019
Filing Date:
January 31, 2019
Export Citation:
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Assignee:
TOKYO ELECTRON LIMITED (3-1 Akasaka 5-chome, Minato-ku Tokyo, 25, 〒1076325, JP)
International Classes:
H01L21/027; H05B3/00
Domestic Patent References:
WO2017057726A12017-04-06
Foreign References:
JP2001143850A2001-05-25
JP2017009848A2017-01-12
JP2006013445A2006-01-12
JP2004072000A2004-03-04
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA 9th fl. 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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