Title:
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2019/159704
Kind Code:
A1
Abstract:
According to the present invention, a heat treatment unit is provided with: a hot plate on which a wafer is placed and which applies heat to the wafer; a heater that heats the hot plate; a plurality of temperature sensors that are provided corresponding to a plurality of channels of the hot plate and that measure the temperature of the hot plate; and a controller. The controller is configured to: calculate, for each of the plurality of channels, a temperature shift amount which is the differences between a display temperature of the temperature sensor and the ideal temperature according to the settings of the heater, and determine whether the temperature shift amount is within a predetermined band width; and specify, as abnormal regions, the channels in which the temperature shift amount is not within the band width.
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Inventors:
MISAKA SHINICHIRO (JP)
Application Number:
PCT/JP2019/003476
Publication Date:
August 22, 2019
Filing Date:
January 31, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/027; H05B3/00
Domestic Patent References:
| WO2017057726A1 | 2017-04-06 |
Foreign References:
| JP2001143850A | 2001-05-25 | |||
| JP2017009848A | 2017-01-12 | |||
| JP2006013445A | 2006-01-12 | |||
| JP2004072000A | 2004-03-04 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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