Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/136670
Kind Code:
A1
Abstract:
A substrate processing device (1) according to an embodiment comprises: a table (4) which supports a substrate (W); a solvent supply unit (8) for supplying the surface of a substrate (W) on the table (4) with a volatile solvent; and an irradiation unit (10) which functions as a heater for heating the substrate (W) to change the volatile solvent into liquid droplets with an air layer generated on the surface of the substrate (W) supplied with the volatile solvent by irradiating the substrate (W) supplied with the volatile solvent with light. Thereby, it is possible to favorably dry a substrate while suppressing the collapse of a pattern.
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Inventors:
MIYAZAKI KUNIHIRO (JP)
HAYASHI KONOSUKE (JP)
OOTAGAKI TAKASHI (JP)
NAGASHIMA YUJI (JP)
HAYASHI KONOSUKE (JP)
OOTAGAKI TAKASHI (JP)
NAGASHIMA YUJI (JP)
Application Number:
PCT/JP2014/055054
Publication Date:
September 12, 2014
Filing Date:
February 28, 2014
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP (JP)
International Classes:
H01L21/304; F26B3/28; F26B5/16
Foreign References:
JP2012138510A | 2012-07-19 | |||
JP2010238918A | 2010-10-21 | |||
JP2002305178A | 2002-10-18 | |||
JPH10199855A | 1998-07-31 | |||
JP2008034779A | 2008-02-14 |
Other References:
See also references of EP 2966673A4
Attorney, Agent or Firm:
Ogawa Shinichi et al. (JP)
Brook Shin-ichi (JP)
Brook Shin-ichi (JP)
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