Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/055877
Kind Code:
A1
Abstract:
A substrate processing device (1) includes a first cup portion (161) which is positioned along the entire circumference radially outside an annular opening (81) formed around a substrate (9), and which receives processing solution scattered from the substrate (9) being rotated. A cup portion moving mechanism (162) moves the first cup portion (161) in an up-down direction between a first position radially outside the annular opening (81) and a second position lower than the first position. A second cup portion (164) is disposed over the first cup portion (161), is positioned along the entire circumference radially outside the annular opening (81) with the first cup portion (161) positioned at the second position, and receives the processing solution scattered from the substrate (9) being rotated. The second cup portion (164) is moved in the up-down direction by a chamber open/close mechanism (131) or by the cup portion moving mechanism (162). Thus, a plurality of types of sealed space can be formed without an increase in the number of mechanisms for moving the constituent elements of the substrate processing device (1).
Inventors:
MIURA TAKEMITSU (JP)
Application Number:
PCT/JP2017/025122
Publication Date:
March 29, 2018
Filing Date:
July 10, 2017
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/306; H01L21/304
Domestic Patent References:
| WO2015098655A1 | 2015-07-02 |
Foreign References:
| JP2014179491A | 2014-09-25 | |||
| JP2014049605A | 2014-03-17 | |||
| JP2014179378A | 2014-09-25 | |||
| JP2015126013A | 2015-07-06 | |||
| JP2012256743A | 2012-12-27 | |||
| JP2014179489A | 2014-09-25 |
Attorney, Agent or Firm:
MATSUSAKA, Masahiro et al. (JP)
Download PDF: