Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/180181
Kind Code:
A1
Abstract:
This substrate processing device includes: a liquid processing unit that supplies a processing liquid to an outer surface of a substrate inside a processing chamber and forms a processing liquid film on the outer surface of the substrate; a solidifying unit that solidifies the processing liquid film inside a solidifying chamber and forms a solidified film on the outer surface of the substrate; a removal processing unit that supplies, to the outer surface of the substrate, a removing liquid for removing the solidified film inside a removal chamber; a main conveying unit that conveys the substrate into the processing chamber and conveys the substrate out of the removal chamber; and a local conveying unit that conveys the substrate out of the processing chamber and conveys the substrate into the solidifying chamber.
Inventors:
OTSUJI MASAYUKI (JP)
TAKAHASHI MITSUKAZU (JP)
HONSHO KAZUHIRO (JP)
TAKAHASHI MITSUKAZU (JP)
HONSHO KAZUHIRO (JP)
Application Number:
PCT/JP2018/007861
Publication Date:
October 04, 2018
Filing Date:
March 01, 2018
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/677
Foreign References:
| JP2014107313A | 2014-06-09 | |||
| JP2015092539A | 2015-05-14 | |||
| JP2003297901A | 2003-10-17 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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