SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

WIPO Patent Application WO/2019/004390

A1

This substrate processing device includes: a suctioning unit for suctioning a processing solution present inside a processing solution pipe communicating with a discharge port; and a control device. The control device performs a suctioning process for suctioning the processing solution present inside the processing solution pipe by means of the suctioning unit. In addition, in the suctioning step, the control device selectively performs: a first suctioning step for retreating the leading end face of the processing solution and disposing the leading end face of the suctioned processing solution at a predetermined waiting position inside the processing solution pipe; and a second suctioning step for retreating the leading end face of the processing solution further than the waiting position. In addition, after the second suctioning step, the control device further performs a waiting position disposing step for supplying the processing solution to the processing solution pipe by means of the processing solution supply unit and disposing the leading end face of the processing solution at the waiting position.

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IWAO MICHINORI (JP)
YASUDA SHUICHI (JP)
FUJITA KAZUHIRO (JP)
KIKUMOTO NORIYUKI (JP)
YAMAGUCHI TAKAHIRO (JP)

PCT/JP2018/024699

January 03, 2019

June 28, 2018

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SCREEN HOLDINGS CO LTD (JP)

H01L21/304; H01L21/306

JP2016072337A	2016-05-09
JP2002170803A	2002-06-14
JP2015109335A	2015-06-11

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