SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

WIPO Patent Application WO/2019/131174

A1

The present invention relates to a device for partially removing material constituting the surface of a substrate. In one embodiment, the substrate processing device comprises a holding mechanism unit (5) for holding the substrate (W), a jet nozzle (7) disposed at a position facing the substrate (W) held by the holding mechanism unit (5), a translational movement device (10) connected to the jet nozzle (7), a slurry supply line (14) connected to the jet nozzle (7), and a compressed gas supply line (15) connected to the jet nozzle (7). The substrate (W) is a semiconductor substrate having protruding portions on the surface facing the jet nozzle (7), and the jet nozzle (7) has a mixing chamber (35) communicating with the slurry supply line (14) and the compressed gas supply line (15) and a spray port (37) communicating with the mixing chamber (35).

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JP2022190879	CERIA-BASED COMPOSITE FINE PARTICLE DISPERSION, MANUFACTURING METHOD THEREOF, AND ABRASIVE PARTICLE POLISHING DISPERSION CONTAINING CERIA-BASED COMPOSITE FINE PARTICLE DISPERSION

HANDA NAOYUKI (JP)
WADA YUTAKA (JP)

PCT/JP2018/045884

July 04, 2019

December 13, 2018

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EBARA CORP (JP)

H01L21/304; B24B37/00; B24B57/02; B24C3/32; B24C5/04; B24C11/00

JPH021632B2	1990-01-12
JP2003145064A	2003-05-20
JPH05345276A	1993-12-27
JP2016049612A	2016-04-11

HIROSAWA, Tetsuya et al. (JP)

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