Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/142708
Kind Code:
A1
Abstract:
This substrate processing device comprises: on an adsorption surface for adsorbing a substrate, a holding section having, as a plurality of regions where adsorption pressures for adsorbing the substrate are controlled independently, a circular first region and an annular second region disposed outward in the radial direction of the first region; a plurality of adsorption pressure generating units for independently generating the adsorption pressures for the respective regions constituting the adsorption surface; a plurality of adsorption pressure adjusting units for independently adjusting the adsorption pressures generated by the respective adsorption pressure generating units; and a control unit for controlling the plurality of adsorption pressure generating units and the plurality of adsorption pressure adjusting units. The control unit causes different adsorption pressures to be generated in at least part of the first region and in at least part of the second region.
Inventors:
SUGAKAWA KENJI (JP)
OMORI YOSUKE (JP)
OMORI YOSUKE (JP)
Application Number:
PCT/JP2019/000371
Publication Date:
July 25, 2019
Filing Date:
January 09, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/02; B23K20/00; H01L21/683
Domestic Patent References:
| WO2017155002A1 | 2017-09-14 | |||
| WO2017137129A1 | 2017-08-17 |
Foreign References:
| JP2015038982A | 2015-02-26 | |||
| JP2018046244A | 2018-03-22 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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