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Patent Searching and Data


Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/071206
Kind Code:
A1
Abstract:
Provided is a substrate processing device capable of imaging a liquid column of processing fluid which is discharged onto the end section of a substrate. The substrate processing device is equipped with a substrate-holding part 20, a cup member 40, a raising/lowering mechanism 44, a first nozzle 31 and a camera 70. The substrate-holding part 20 holds a substrate W and rotates the substrate W. The cup member 40 surrounds the outer circumference of the substrate-holding part 20. The raising/lowering mechanism 44 raises the cup member 40 in a manner such that the upper end section of the cup member 40 is positioned at an upper end position which is higher than the substrate W held by the substrate-holding part 20. The first nozzle 31 has a discharge port located in a position which is lower than is the upper end position, and discharges the first processing fluid from the discharge port onto the end section of the substrate W. The camera 70 images an imaging region which includes the first processing fluid discharged from the discharge port of the first nozzle 31, and is seen from an imaging position above the substrate W.

Inventors:
NAOHARA HIDEJI (JP)
OKITA YUJI (JP)
KAKUMA HIROAKI (JP)
MASUI TATSUYA (JP)
Application Number:
PCT/JP2019/037585
Publication Date:
April 09, 2020
Filing Date:
September 25, 2019
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; B05C11/00; B05C11/08; B05C11/10; B05D1/40; B05D3/00; B05D3/10
Foreign References:
JP2012009812A2012-01-12
JP2015152475A2015-08-24
JP2011181588A2011-09-15
JP2016136572A2016-07-28
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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