Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/170597
Kind Code:
A1
Abstract:
This substrate processing device is for processing a substrate. A surface film is formed on the surface of the substrate. The substrate processing device is equipped with a first surface processing unit processing the surface film in an outer peripheral section of the substrate, which is a region wherein a modified layer is planned to be formed, to form a first processing region. In the first processing region, the surface film is removed at least to such a depth that the surface of the substrate becomes exposed.
Inventors:
TANOUE HAYATO (JP)
Application Number:
PCT/JP2019/050391
Publication Date:
August 27, 2020
Filing Date:
December 23, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B23K26/53; H01L21/02; H01L21/301; H01L21/304
Foreign References:
| JP2006286727A | 2006-10-19 | |||
| JP2014007330A | 2014-01-16 | |||
| JP2007258196A | 2007-10-04 | |||
| JP2016004799A | 2016-01-12 | |||
| JP2004111606A | 2004-04-08 | |||
| JP2018043340A | 2018-03-22 | |||
| US20150221517A1 | 2015-08-06 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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