Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/235347
Kind Code:
A1
Abstract:
A substrate processing device for processing a substrate having a substrate holding portion having a holding surface for holding a substrate, a substrate processing portion for performing the desired processing on the substrate held on the holding surface, and a flatness adjusting portion for adjusting the flatness of the holding surface by applying pressure from the back surface side of the substrate holding portion. Also, a substrate processing method for processing a substrate equipped with a step for adjusting the flatness of the substrate holding surface by applying pressure from the back surface side of the substrate holding portion, a step for holding the substrate on the holding surface, the flatness of which has been adjusted, and a step for performing the desired processing on the substrate held on the holding surface.
Inventors:
IKEDA FUMIHIKO (JP)
Application Number:
PCT/JP2020/018561
Publication Date:
November 26, 2020
Filing Date:
May 07, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B05C11/00; B05C5/02; B05C11/10; B05C13/00; B05D1/26; B05D3/12; G02F1/1335; G02F1/13363; H01L21/683
Foreign References:
| JP2006216696A | 2006-08-17 | |||
| JP2010251535A | 2010-11-04 | |||
| JP2007203258A | 2007-08-16 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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