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Patent Searching and Data


Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/132443
Kind Code:
A1
Abstract:
The present invention is provided with: a processing-solution discharge part that is provided below a substrate held on a substrate holding part and that discharges a processing solution from a processing-solution discharge port towards an internal bottom surface of a storage space; and an air-bubble supply part that is provided below the substrate held on the substrate holding part and above the processing-solution discharge port and that supplies air bubbles to the processing solution stored in the storage space. Between the air-bubble supply part and the processing-solution discharge port in the vertical direction, at least a portion of a processing solution flowing upward via the internal bottom surface of the storage space is made to serve as a liquid to be split, and the flow of the liquid to be split is split into a plurality of upward flows, which are guided to the substrate held on the substrate holding part.

Inventors:
TAKAHASHI TOMOHIRO (JP)
KISHIDA TAKUYA (JP)
ORISAKA MASAYUKI (JP)
TAKECHI KEI (JP)
Application Number:
PCT/JP2020/048378
Publication Date:
July 01, 2021
Filing Date:
December 24, 2020
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/306
Foreign References:
JPH0722371A1995-01-24
JPH0254528A1990-02-23
JP2016200821A2016-12-01
JP2010040758A2010-02-18
JP2019145686A2019-08-29
JP2012114228A2012-06-14
JPH1126419A1999-01-29
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
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