Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/215145
Kind Code:
A1
Abstract:
A device that processes a polymer substrate having a first substrate and a second substrate bonded thereto. The device has: a holding member that holds the polymer substrate; a removal member that peels at least the edge from the first substrate from the second substrate, by being inserted between the first substrate and the second substrate; a raising/lowering mechanism that adjusts the height position of the removal member relative to the holding member; and a control unit that controls the operation of the raising/lowering mechanism. The control unit controls the operation of the raising/lowering mechanism so as to adjust the height position of the removal member relative to the target insertion position of the removal member, across the entire circumference of the polymer substrate.
Inventors:
YAMAWAKI YOHEI (JP)
NAKANO SEIJI (JP)
HAYASHI TOKUTAROU (JP)
NAKANO SEIJI (JP)
HAYASHI TOKUTAROU (JP)
Application Number:
PCT/JP2021/010662
Publication Date:
October 28, 2021
Filing Date:
March 16, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/02; H01L21/304
Domestic Patent References:
| WO2019176589A1 | 2019-09-19 | |||
| WO2019208359A1 | 2019-10-31 | |||
| WO2019208298A1 | 2019-10-31 |
Foreign References:
| JP3225828U | 2020-04-09 | |||
| US20160093518A1 | 2016-03-31 | |||
| JP2008537316A | 2008-09-11 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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