Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/249787
Kind Code:
A1
Abstract:
According to the present invention, the wear amount of a polishing pad is measured using a simple structure. This substrate processing device 1000 comprises: a table 100 for supporting a substrate WF having a surface to be polished that faces upward; a pad holder 226 that holds a polishing pad 222 for polishing the substrate WF supported by the table 100; a hoisting mechanism 260 for hoisting the polishing pad 222 held by the pad holder 226; and a wear amount measuring member 270 that measures the wear amount of the polishing pad 222 on the basis of a value correlating movements of the hoisting mechanism 260 until the polishing pad 222 is lowered by the hoisting mechanism 260 to contact a reference surface.
Inventors:
SATO YUICHI (JP)
OHSHIMA KOHEI (JP)
OHSHIMA KOHEI (JP)
Application Number:
PCT/JP2022/017904
Publication Date:
December 01, 2022
Filing Date:
April 15, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B49/10; B24B37/10; H01L21/304
Domestic Patent References:
| WO2019195087A1 | 2019-10-10 |
Foreign References:
| JP2004025413A | 2004-01-29 | |||
| JP5115839B2 | 2013-01-09 | |||
| JP2005081461A | 2005-03-31 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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