Title:
SUBSTRATE PROCESSING DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2018/163386
Kind Code:
A1
Abstract:
Provided is a technology for enabling uniform substrate processing. The technology comprises: a processing chamber for processing a substrate; a heating device including a plurality of microwave supply sources for supplying microwaves for heating a substrate in the processing chamber; and a control unit configured to control the plurality of microwave supply sources so that the plurality of microwave supply sources are turned off in different periods while each of the plurality of microwave supply sources supplies a constant microwave input power to the substrate.
Inventors:
SASAKI SHINYA (JP)
HIROCHI YUKITOMO (JP)
MICHITA NORIAKI (JP)
HIROCHI YUKITOMO (JP)
MICHITA NORIAKI (JP)
Application Number:
PCT/JP2017/009610
Publication Date:
September 13, 2018
Filing Date:
March 09, 2017
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H01L21/268
Foreign References:
| JP2013058652A | 2013-03-28 | |||
| JPH0590885U | 1993-12-10 | |||
| JPH0456090A | 1992-02-24 | |||
| JP2012084510A | 2012-04-26 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
Download PDF:
Previous Patent: COMPONENT RECOGNITION DEVICE
Next Patent: ANALYSIS DEVICE, ANALYSIS METHOD, AND ANALYSIS PROGRAM
Next Patent: ANALYSIS DEVICE, ANALYSIS METHOD, AND ANALYSIS PROGRAM