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Patent Searching and Data


Title:
SUBSTRATE PROCESSING DEVICE AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/186681
Kind Code:
A1
Abstract:
In one embodiment of the present invention, a substrate processing device is provided that can suppress a rise in the temperature of an O-ring part below an exhaust tube, even if the opening diameter of the exhaust tube 15 has been widened. Provided is a configuration comprising: a reaction tube comprising a substrate holding tool for holding a plurality of substrates, a cylindrical inner tube 4B having, at a lower side thereof, an opening wherethrough the substrate holding tool can exit and enter, and a cylindrical outer tube whereof the upper end is closed, provided with a flange in the outer periphery of the lower end, and constituted in such a manner as to surround the inner tube; a heater for heating the inner side of an oven body that surrounds the top and the side of the reaction tube; a counterpart-side member whereto the flange is connected via the O-ring 19B; and a gas supply mechanism for supplying a gas to the plurality of substrates held in the reaction tube. The reaction tube comprises an exhaust tube 15 near the flange, establishing fluid communication between the exterior of the outer tube and the space between the inner tube and the outer tube, and a scattering plate 30 provided along the outer surface of the inner tube at a position facing the exhaust tube 15. Note: selected drawing is FIG. 3.

Inventors:
OKAJIMA Yusaku (1 Yasuuchi 2-chome, Yatsuo-machi, Toyama-sh, Toyama 93, 〒9392393, JP)
SAIDO Shuhei (1 Yasuuchi 2-chome, Yatsuo-machi, Toyama-sh, Toyama 93, 〒9392393, JP)
YOSHIDA Hidenari (1 Yasuuchi 2-chome, Yatsuo-machi, Toyama-sh, Toyama 93, 〒9392393, JP)
SASAKI Takafumi (1 Yasuuchi 2-chome, Yatsuo-machi, Toyama-sh, Toyama 93, 〒9392393, JP)
Application Number:
JP2018/012337
Publication Date:
October 03, 2019
Filing Date:
March 27, 2018
Export Citation:
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Assignee:
KOKUSAI ELECTRIC CORPORATION (3-4 Kandakaji-cho, Chiyoda-ku TOKYO, 45, 〒1010045, JP)
International Classes:
H01L21/205; C23C16/44; H01L21/20; H01L21/22; H01L21/31
Foreign References:
JP2011003689A2011-01-06
JP2008199040A2008-08-28
JP2011176178A2011-09-08
JP2002334868A2002-11-22
Attorney, Agent or Firm:
POLAIRE I.P.C. (13-11, Nihonbashikayabacho 2-chome Chuo-k, Tokyo 25, 〒1030025, JP)
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