Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE TRANSFER METHOD
Document Type and Number:
WIPO Patent Application WO/2014/077379
Kind Code:
A1
Abstract:
Provided is a substrate processing device capable of improving throughput without increasing the operation speed of a drive device. Vacuum processing chambers (12A, 12C) which house a wafer (W) for plasma processing of the wafer are respectively provided with gate valves (25A, 25C) for opening and closing a wafer inlet/outlet port, and wafer detection sensors (35α, 35γ) for detecting the wafer (W) moving forward or backward through the wafer inlet/outlet port, and a scalar robot (15) for making extending/retracting motion and rotating motion transfers the wafer (W) from the vacuum processing chamber (12A) to the vacuum processing chamber (12C). At this time, the scalar robot (15) starts the rotating motion to transfer the wafer (W) picked up from the vacuum processing chamber (12A) to the vacuum processing chamber (12C) in response to a trigger signal transmitted from the wafer detection sensor (35α). The trigger signal indicates that the wafer (W) is past the wafer inlet/outlet port of the vacuum processing chamber (12A) and has arrived at a point where the gate valve (25A) and the wafer inlet/outlet port no longer interfere with the wafer (W).
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Inventors:
WAKABAYASHI SHINJI (JP)
Application Number:
PCT/JP2013/080970
Publication Date:
May 22, 2014
Filing Date:
November 12, 2013
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/677; B65G49/07
Foreign References:
| JP2002043394A | 2002-02-08 | |||
| JP2001110873A | 2001-04-20 | |||
| JP2001515655A | 2001-09-18 | |||
| JP2011514652A | 2011-05-06 | |||
| JP2009124078A | 2009-06-04 | |||
| JPH1064971A | 1998-03-06 |
Attorney, Agent or Firm:
BECCHAKU, Shigehisa et al. (JP)
Role of another Shigehisa (JP)
Role of another Shigehisa (JP)
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