Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/114977
Kind Code:
A1
Abstract:
The substrate processing device has an exhaust mechanism for evacuating the interior of a processing container. The processing container comprises: a bottomed main body part with an open upper face; a cylindrically-shaped cylinder part provided with a flange for hermetically closing the upper face of the main body part, and a side wall whereof the diameter is smaller than that of the main body part and whereof the diameter is larger than that of the outer face of a stage; and, provided on the upper face of the flange, a lid body for hermetically closing the opening of the main body part. A groove portion depressed downward into a U shape is formed on the upper face of the flange, a heater being disposed in said groove portion. The side wall of the cylinder part is formed so as to extend lower than the upper face of the stage. Provided at the lower end of the side wall is a locking member protruding towards the center of the side wall. A baffle plate having a plurality of holes formed therein is provided on the upper face of the locking member.
Inventors:
MIDORIKAWA YOHEI (JP)
TANAKA ATSUSHI (JP)
TANAKA ATSUSHI (JP)
Application Number:
PCT/JP2014/083380
Publication Date:
August 06, 2015
Filing Date:
December 17, 2014
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/302; H01L21/3065
Domestic Patent References:
| WO2009013984A1 | 2009-01-29 |
Foreign References:
| JP2011249470A | 2011-12-08 | |||
| JP2010016319A | 2010-01-21 | |||
| JP2003510810A | 2003-03-18 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Tetsuo Kanamoto (JP)
Tetsuo Kanamoto (JP)
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