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Patent Searching and Data


Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/179685
Kind Code:
A1
Abstract:
A substrate processing device having a substrate polishing unit 40 provided with a polishing pad for polishing a wafer W, and a top ring 41 for holding the wafer and pushing the wafer toward the polishing pad. An elastic film 80 that holds a surface of the wafer W on the side opposite from the polishing surface is attached as an expendable component to the top ring 41. A plurality of distortion sensors 85, 86 that measure distortion occurring in the elastic film 80 during polishing are provided to the elastic film 80, and data of a distortion amount is read out to a control device 15 by detection units 90, 91. The control device 15 sets process conditions such as a polishing recipe for the wafer W on the basis of distortion information of the elastic film 80 measured by the distortion sensors.

Inventors:
NAMIKI Keisuke (11-1 Haneda Asahi-cho, Ohta-k, Tokyo 10, 〒1448510, JP)
FUKUSHIMA Makoto (11-1 Haneda Asahi-cho, Ohta-k, Tokyo 10, 〒1448510, JP)
Application Number:
JP2018/000912
Publication Date:
October 04, 2018
Filing Date:
January 16, 2018
Export Citation:
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Assignee:
EBARA CORPORATION (11-1, Haneda Asahi-cho Ohta-k, Tokyo 10, 〒1448510, JP)
International Classes:
H01L21/304; B23Q15/16; B24B37/30; B24B49/10; H01L21/02
Domestic Patent References:
WO2000045993A12000-08-10
Foreign References:
JP2011194509A2011-10-06
JP2008310404A2008-12-25
JP2014223684A2014-12-04
JP2009542449A2009-12-03
JP2014011432A2014-01-20
JP2015051501A2015-03-19
JP2001009712A2001-01-16
Attorney, Agent or Firm:
OHNO Seiji et al. (OHNO & PARTNERS, Marunouchi Kitaguchi Building 21F 6-5, Marunouchi 1-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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