Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/230457
Kind Code:
A1
Abstract:
A wet etching device is provided with: a substrate transfer unit which includes an etching liquid ejection unit or a cleaning liquid ejection unit for supplying an etching liquid or a cleaning liquid to a surface to be processed of a mother glass substrate, a parallel rotary shaft of which the axis direction is parallel with the surface to be processed, and a substrate transfer roller which is journaled to the parallel rotary shaft and supports the mother glass substrate in such a manner as to be transferrable from the opposite side to the side of the surface to be processed, the substrate transfer unit transferring the mother glass substrate; and an auxiliary substrate transfer unit which includes an intersecting rotary shaft of which the axis direction intersects the surface to be processed, and a substrate pressing roller which is journaled to the intersecting rotary shaft and presses the mother glass substrate from the side of the surface to be processed in a transferrable state. The auxiliary substrate transfer unit is disposed with a part thereof not overlapping the mother glass substrate, and assists the transfer of the mother glass substrate.
Inventors:
ITANI AKIRA
Application Number:
PCT/JP2018/021994
Publication Date:
December 20, 2018
Filing Date:
June 08, 2018
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
H01L21/306; B08B3/02
Domestic Patent References:
WO2010087435A1 | 2010-08-05 |
Foreign References:
JPH1111631A | 1999-01-19 | |||
JP2003104544A | 2003-04-09 | |||
JP2008026859A | 2008-02-07 | |||
JP2004031444A | 2004-01-29 | |||
JP2017088356A | 2017-05-25 | |||
JP2006327819A | 2006-12-07 | |||
JP2007165654A | 2007-06-28 | |||
US20160264360A1 | 2016-09-15 | |||
KR20110112260A | 2011-10-12 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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