Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/053841
Kind Code:
A1
Abstract:
The purpose of the present invention is to subject a substrate to different types of processing without requiring an addition of a new device or an increase in tact time. Provided is a substrate manufacturing method comprising a substrate processing step of subjecting a substrate (8) to processing using a processing liquid (22) in which, by controlling the magnitude of a gap (16) between the substrate (8) and a cover (4) covering a nozzle (6) for spraying the processing liquid (22) from above the substrate (8), accumulation on the substrate (8) of the processing liquid (22) having been sprayed from the nozzle (6) is controlled.
Inventors:
ASANO HIROMITSU
Application Number:
PCT/JP2017/033270
Publication Date:
March 21, 2019
Filing Date:
September 14, 2017
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
H01L21/306; C23F1/08; H01L21/304
Foreign References:
| JP2000216083A | 2000-08-04 | |||
| JP2002208563A | 2002-07-26 | |||
| JP2008124203A | 2008-05-29 | |||
| JPH07161675A | 1995-06-23 | |||
| JP2007073784A | 2007-03-22 | |||
| JPS5970763U | 1984-05-14 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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