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Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/107191
Kind Code:
A1
Abstract:
Provided is a substrate processing device comprising: a processing vessel that houses a substrate; a mounting table on which the substrate is mounted within the processing vessel; an exhaust part that exhausts processing gas within the processing vessel; and a partition wall that is arranged within the processing vessel and that surrounds the mounting table, wherein an exhaust flow path communicating with the exhaust part over the entire circumference is formed inside the partition wall so as to extend in the vertical direction, and a plurality of openings communicating with the exhaust flow path and a substrate processing space formed inside the partition wall and above the mounting table are formed at equal intervals along the inner circumferential direction of the partition wall.

Inventors:
ASAKAWA YUJI (JP)
AMIKURA MANABU (JP)
Application Number:
PCT/JP2018/042523
Publication Date:
June 06, 2019
Filing Date:
November 16, 2018
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/302
Foreign References:
JPH08162439A1996-06-21
JP2016536797A2016-11-24
JP2009503876A2009-01-29
JP2016029700A2016-03-03
JP2007524236A2007-08-23
JP2005244244A2005-09-08
JP2000030894A2000-01-28
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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