Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/145737
Kind Code:
A1
Abstract:
The present invention provides a device for processing a substrate. The device for processing a substrate comprises: a housing having a processing space provided therein; a support unit disposed in the housing to support the substrate; and a plasma generating unit provided above the housing, wherein the plasma generating unit comprises: a plasma chamber having a discharge space formed therein; a diffusion member, which is provided between the plasma chamber and the housing and diffuses plasma; a plasma source for generating plasma in the discharge space from a processing gas; and a sealing member provided between a lower flange of the plasma chamber and an upper flange of the diffusion member, and the sealing member may comprise an inner sealing member inserted into a mounting groove formed on the upper surface of the upper flange, and an outer sealing member inserted into an in-between space formed by combining the upper flange and the lower flange with each other, and positioned farther outside the discharge space than the inner sealing member.
Inventors:
SIM KWANG BO (KR)
LEE SANG YEOL (KR)
YOON JI HOON (KR)
YU SEUNG YE (KR)
LEE SANG YEOL (KR)
YOON JI HOON (KR)
YU SEUNG YE (KR)
Application Number:
PCT/KR2021/017513
Publication Date:
July 07, 2022
Filing Date:
November 25, 2021
Export Citation:
Assignee:
PSK INC (KR)
International Classes:
H01J37/32
Foreign References:
| KR102116475B1 | 2020-05-28 | |||
| JP2000106298A | 2000-04-11 | |||
| KR20170070543A | 2017-06-22 | |||
| KR101369404B1 | 2014-03-06 | |||
| US20110139614A1 | 2011-06-16 |
Attorney, Agent or Firm:
KWON, Hyuk-Soo et al. (KR)
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