Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/021856
Kind Code:
A1
Abstract:
This substrate processing device is provided with a substrate holding unit for holding a substrate, and a plasma reactor (1). The plasma reactor (1) emits plasma onto a main surface of the substrate. The plasma reactor (1) comprises: at least one electrode (111, 121); wiring (16A, 16B) connected to at least one dielectric (13, 14) and to a plasma power source (16); a holding member (20); and a seal member (30). The electrodes (111, 121) are disposed in a plasma space (H2). The dielectrics (13, 14) cover the electrodes (111, 121). The holding member (20) includes an accommodating space (H1) for accommodating connecting portions (C1, C2) connecting end portions of the electrodes (111, 121) and the wiring (16A, 16B). The seal member (30) includes at least one through hole (35b, 36b) through which the electrodes (111, 121) penetrate, and is attached to the holding member (20) to divide the accommodating space (H1) and the plasma space (H2).
Inventors:
NAMBA TOSHIMITSU (JP)
Application Number:
PCT/JP2022/025925
Publication Date:
February 23, 2023
Filing Date:
June 29, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; G03F1/80; H01L21/3065
Domestic Patent References:
| WO2021153060A1 | 2021-08-05 |
Foreign References:
| JP2020524903A | 2020-08-20 | |||
| JP2018133326A | 2018-08-23 | |||
| JPH0813169A | 1996-01-16 | |||
| JP2017172019A | 2017-09-28 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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